封装研发经理2-2.5万/月

Job Responsibilites:
1. Lead researching the packaging materials, responsible for characterization, application and selection.
2. Lead developing new equipment technology along with the package roadmap.
3. Ensure new packages, technology and material being developed are cost effective and fully characterized and robust for mass production.
4. Lead plant level cross functional key project.
5. Lead junior engineer and train the basic skill, knowledge.
6. Support critical customer issues, including investigation, experiment, simulations, and CIP, etc.
7. Play a role as a technical expert and help make preliminary technical conclusion in team discussion.
8. Responsible for design for manufacturing (DFM) for the success of customer products.
9. Lead QTR/QBR with customer and supplier.
10. Lead development of package and technology roadmap that meet future business/customer requirements and increase the organization’s competitive position.
11. Lead development of package and technology roadmap that meet future business/customer requirements and increase the organization’s competitive position.
12. Lead package and technology innovation / IP generation.
13. Other duties as assigned by supervisor.

Job Qualifications:
1，Bachelor Degree or above in electrical, mechanical, thermal engineering or equivalent.
2, Excellent oral and written skills in English or Mandarin.
3. ＞15 years’ work experience including 5~8 years’ semiconductor industry experience in a high paced environment .
4. Package definition
5. Failure analysis
6. Wafer process and semiconductor knowledge
7. DFM methodology