半导体工艺工程师面议

· Overall yield management to cover assembly and test for specific product.


· Commonality analysis by product design/process/machine/material/measurement, Coordinate different teams to dig out the root cause and come out effective improvement plan.


· Conduct engineering DOEs and apply statistical analysis method to solve problems, make decision with data.


· Assembly process set up and continuously improvement (Wire Bond process. Familiar with K&S Ultra, INCONN machine type).


· Production line excursion/abnormal case disposition.


· Engineering value (cost reduction) project follow up and implement.


· Production capacity/productivity continuously improvement.



Qualifications


REQUIRED:

· Bachelor or above, major in Automation, Mechatronics, Materials Science and Technology, etc.

· 1-3 years’ process experience in Assembly (Wire bonding process).

· Good communication skill and team work spirit, willing to work under certain pressure.



PREFERRED:

· Strong Knowledge at Wire bond process.

· Good at AutoCAD, 3D drawing, Animations, Solidworks, JMP (Or other similar statistic software, Spot-fire) etc.

· Familiar with one of programming language will be a plus.


SKILLS:


· Good communication skill at both Chinese and English.